What is Thermpaq?

Thermpaq is a new software product from Flomerics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. An intuitive wizard-driven user interface, interoperability with package-level EDA tools, and enterprise-level data scalability and portability are the other key features of Thermpaq.

Built around Flopack, the well-established package smartpart technology, and the industry leader Flotherm's CFD solver technology,Thermpaq greatly boosts productivity of thermal analysts in the semiconductor industry.

Who Can Use Thermpaq?

Thermpaq is designed to be used by all those involved in the thermal design and characterization of semiconductor packages.

What Are Thermpaq's Key Features?

• Extensive Package Catalog

  Thermpaq supports an extensive catalog of more than 40 package families – Plastic and Ceramic BGAs (wire-bonded and flip-chip), leaded families such as PQFP, PLCC, TSOP, Chip Scale and Near-Chip Scale packages such as QFN, MicroBGA^TM, and MicroStar BGA^TM, power electronics packages such as TO-220, DPAK, D2PAK, SOT23, and the more recent stacked-die/MCM families.

• Part Definition Imported from Package-Level EDA Software

  The entire substrate design can be imported from Cadence Allegro Package Designer through an intelligent wizard that helps the user select the appropriate package family and populate the relevant Thermpaq data sheet, automating package model creation. Once imported the package data is editable, so the process is fully under the user’s control.

• Part Definition Driven by SmartPart Wizard

  In initial, conceptual stages of the design physical layout data for the package may not be available. That’s when Thermpaq’s wizard-driven SmartPart engine is useful. It generates the package model with just a few clicks based on high-level inputs such as the JEDEC outline, pincount, and power. In-built design rules based on industry inputs ensure that the generated package is representative of an actual package for the given outline.

• Part Definition Driven by XML or CSV

  If your package input data is in XML or CSV format, you can import it directly into Thermpaq in a one-click operation.

• Automated generation of all JEDEC Thermal Metrics

  Thermpaq allows a wizard-driven automatic generation of the complete set of JEDEC thermal data metrics for a single package or multiple packages in batch on standard and user-defined test PCBs. Metrics supported include θ_JA,θ_JMA (at various flow rates),Ψ_JT, Ψ_JB,Ψ_JP,θ_JB,θ_JC.

• Automated Compact Thermal Model Creation

  Two-resistor (2-R) and DELPHI compact thermal models of the package can be generated for single packages or multiple packages in batch.

• Sensitivity Analysis Capability

  Vary leading package parameters such as die size, power, die attach conductivity, lead pitch etc. and, in just a few mouse clicks, let Thermpaq calculate any combination of JEDEC metrics and compact models for the multiple scenarios that result.

• Searchable Results Database

  Thermpaq automated and batch features allow extremely rapid generation of large amounts of data for metrics and models. Use the advanced Results Database feature to conduct a multi-parameter search from your previous solutions and select the optimal starting point for a new package design.

• Libraries

  Thermpaq represents the package as a collection of libraries for all package constitutive package elements such as die, die attach, die pad, leadframe, substrate, lid ,etc. Build up new package models even more quickly by assembling pre-stored libraries.

• Post-processing Capabilities

  Thermpaq allows the export of all metrics data as Excel-compatible CSV files. Compact models are available in the form of Compact Component smartpart and Network Assembly format. Results from solved cases can be visualized as fill plots, vector plots or animations.

• Continuous Update of Package Families

  The package models Thermpaq supports are being continuously updated to capture the rapid advances in packaging technology, particularly System-in-Package (SiP) and stacked-die.

How Does Thermpaq Save My Company Money?

Flomerics research reveals that a typical semiconductor thermal group spends approximately 60% of its time on standard package thermal characterization and design and the rest on customer-specific simulations. Thermpaq drastically reduces the time spent on standard package thermal characterization and design, and saves around 25% of the time spent on customer-specific work. To see the savings for your group use the Return-on-Investment calculator below.

Beyond the financial benefits, Thermpaq also enhances the quality, reliability and availability of package thermal models by providing a fast, simple, proven, automated process thus reducing the risk of modeling errors.